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Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are becoming thinner and sleeker. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive pastes and films. This encourages the manufacturers to develop new materials and design sleeker adhesion lines.

The global adhesive pastes and films market in the semiconductor packaging industry is expected to grow at a CAGR of 5.9% during 2012-2017. In terms of market segments, adhesive film will be the major segment. Henkel, Hitachi Chemical, AIT, and Sumitomo Bakelite are some of the manufacturers for various applications in the global adhesive pastes and films market in the semiconductor packaging industry.

Lucintel, a leading global management consulting and market research firm, has analyzed the consumption of adhesive pastes and films in the semiconductor packaging industry and has come up with a comprehensive report, “Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis.” This study provides a concise overview of the global adhesive pastes and films market in terms of value and opportunities for growth. The study also includes forecasts for the global adhesive pastes and films market in the semiconductor packaging industry through 2017 segmented by regions, applications, and raw material types as follows:

The global adhesive pastes and films market in the semiconductor packaging industry segmented by regions:
• North America
• Europe
• APAC
• ROW

The global adhesive pastes and films market in the semiconductor packaging industry segmented by applications for the above regions:
• Dicing
• Back-Grinding
• Die-Attachment

The global adhesive pastes and films market in the semiconductor packaging industry segmented by raw material types:
• Epoxy
• Silicone
• Polymide
• Acrylic Resins

This 107-pages research report will enable you to make confident business decisions in the global adhesive pastes and films market in the semiconductor packaging industry. For a detailed table of contents and pricing information on this timely, insightful report, click on this link http://www.lucintel.com/reports/chemical_composites/global_adhesive_paste_and_film_market_in_semiconductor_packaging_industry_2012-2017_trends_forecast_and_opportunity_analysis_february_2013.aspx or contact Lucintel at +1-972-636-5056 or via email at helpdesk@lucintel.com. Lucintel offerings include Chemical Market Research Reports, Chemical Industry Analysis Report, Opportunity Screening and Analysis, Market Research Report and SWOT Analysis.
Lucintel provides cutting-edge decision support services that facilitate critical decisions with greater speed, market insight, and cost efficiency. To learn more, visit www.lucintel.com. You can also contact us through Live Chat in its website to answer your questions in real time.
About Lucintel
Lucintel, the premier global management consulting and market research firm creates winning strategy for growth—whether you need to understand market dynamics, identify new opportunities, or increase your profitability. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. Over the last 15 years, Lucintel has served over 1,000 corporations in 70 countries. For further information, visit www.lucintel.com


Category : Business
Tags : chemical market research repor, chemical industry analysis rep
URL : http://www.lucintel.com/reports/chemical_composites/global_adhesive_paste_and_film_market_in_semiconductor_packaging_industry_2012
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Date Added : 28-5-2015